BGM13HBA12E6327XTSA1

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The BGM1033N7E6327XUSA1 is MODULE GPS FRONT-END TSNP-7-10, that includes BGM1033N7 Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 6-WDFN Exposed Pad, that offers Frequency features such as 1575.42MHz, Function is designed to work in GPS Front End, as well as the TSNP-7-10 Supplier Device Package, the device can also be used as GPS RF Type. In addition, the Part # Aliases is 1033N7 BGM BGM1033N7E6327XT E6327 SP000892662.

BGM1032N7 with user guide manufactured by INFINEON. The BGM1032N7 is available in QFN Package, is part of the RF Misc ICs and Modules.

BGM1032N7 E6327 with circuit diagram manufactured by INFINEON. The BGM1032N7 E6327 is available in QFN Package, is part of the RF Misc ICs and Modules.

The BGM1032N7E6327XUSA1 is RF Front End RF SILICON MMIC manufactured by Infineon. The BGM1032N7E6327XUSA1 is available in PG-TSNP-7 Package, is part of the RF Front End (LNA + PA), , and with support for RF Front End RF SILICON MMIC, RF IC GPS Front End GPS 1575.42MHz TSNP-7-10, LNA RF Front End 14.8dB 2dB 6-Pin TSNP EP.