STOOPF214A0Z032S01

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The F-213Z is POWER XFMR CHASSIS MOUNT W/LUGS, that includes Chassis Mount Series, they are designed to operate with a Industrial Control Transformers Product, Type is shown on datasheet note for use in a Laminated Core, that offers Packaging features such as Bulk, Unit Weight is designed to work in 2.300 lbs, as well as the Chassis Mounting Style, the device can also be used as Solder Lug Termination Style. In addition, the Height is 3 1/8 in, the device is offered in 2 3/8 in Length, the device has a 3 5/8 in of Width, and Mounting Type is Chassis Mount, and the Size Dimension is 92.07mm L x 60.32mm W, and Current Output Max is Parallel 2A, Series 1A, and the Power Max is 48 VA, and Voltage Isolation is 1500Vrms, and the Height Seated Max is 79.38mm, and Voltage Primary is 115V, 230V, and the Voltage Secondary Full Load is Parallel 24V, Series 48V, and Primary Winding s is Single, and the Secondary Winding s is Dual, and Center Tap is No, and the Power Rating is 48 VA, and Primary Voltage Rating is 115 V Parallel 230 V Series, and the Secondary Voltage Rating is 24 V Parallel 48 V Series, and Secondary Current Rating is 2 A Parallel 1 A Series, and the Primary Winding is Single Primary Winding, and Secondary Winding is Single Secondary Winding, and the Operating Frequency is 50 Hz/60 Hz.

The F2138AFA20V is IC MCU 16BIT 128KB FLASH 80QFP manufactured by HIT. The F2138AFA20V is available in 80-BQFP Package, is part of the Embedded - Microcontrollers, , and with support for IC MCU 16BIT 128KB FLASH 80QFP.

The F21397-000 is Fuse Chip Fast Acting 5A SMD Solder Pad 0603 Ceramic T/R manufactured by TE. is part of the IC Chips, , and with support for Fuse Chip Fast Acting 5A SMD Solder Pad 0603 Ceramic T/R.

F2140BTE10 with EDA / CAD Models manufactured by RENESAS. The F2140BTE10 is available in QFP Package, is part of the IC Chips.